Temperature measuring device and temperature measuring method

ABSTRACT

A temperature measuring device and a temperature measuring method are provided which are capable of obtaining precise measured temperature values with respect even to old persons, sucklings or infants, which device may be formed into a disposable type according to need, which method may be carried out using such a disposable type device according to need, and which enable precise temperature measurement in real time. An on-subject temperature measuring device  1 , which is attached to a subject when a temperature of the subject is measured, receives a radio wave from a reader  2  as an external device and is thereby electrically powered. Using the electric power, temperature measurement is performed in the on-subject temperature measuring device  1 . The results of the measurement are transmitted through radio waves to the reader  2  in the form of a temperature of the subject and ID data. The reader  2  is so constructed as to be connectable to a personal computer (not shown), and data processing by the personal computer is performed according to need.

TECHNICAL FIELD

The present invention relates to a temperature measuring device which ispreliminarily attached to a surface of a subject of temperaturemeasurement to carry out temperature measurement. In particular, itrelates to a temperature measuring device and a temperature detectingmethod which, if a subject of temperature measurement is for example ahuman body, are capable of instantaneously and precisely measuring atemperature from the outside of clothing on the human body.

BACKGROUND ART

In relation to a shape of a temperature detecting part of an electronicthermometer, for example, there has been proposed in Japanese UnexaminedPatent Publication No. 133030/1988 an electronic thermometer which isattachable to a body surface and has a discoidal shape. However, atemperature detecting part which has been practically used generally hasa rod-like shape, and measurement of body temperatures has beenconducted by holding or inserting such a temperature detecting parthaving a rod-like shape under or in a specific site such as an armpit, arectum, a mouth or the like.

As temperature measuring modes in such electronic thermometers, therehave been employed an estimation mode in which a rate of bodytemperature increase is detected in a predetermined period of time fromjust after initiation of temperature detection, and a settledtemperature is calculated based on the rate of change to indicate thecalculated temperature as a body temperature; and an actual measurementmode in which measurement is performed until detected temperaturessubstantially settle.

A temperature indication mode in an electronic thermometer is such amode that indication of the maximum value of temperatures of a body iskept, as in the case of a mercury or alcohol thermometer. Accordingly,it is necessary to once reset temperature indication when a subsequenttemperature detection is conducted.

In an electronic thermometer, a temperature detecting part is generallymade of a metallic material capable of facilitating thermal conductionor a flexible material such as a silicone or the like and formed into arod-like shape. However, if such a rod-like shaped temperature detectingpart is put under an armpit, there are difficulties as follows. In thecase of a thin figured parson, it is difficult to stably hold therod-like shaped temperature detecting part because a gap is likely to beformed under the person's armpit from the first. Particularly in a caseof an old person, it is difficult to precisely detect a body temperaturebecause the person's muscle has become weak and flabby and an enlargedgap is consequently tends to be formed under the person's armpit.

In the case of a suckling or an infant, it is not easy to stably andcontinuously hold the rod-like shaped temperature detecting part over atemperature detecting period of a several minutes, and it is accordinglydifficult to precisely detect a body temperature.

In the case of oral thermometry, to prevent a sublingual temperaturefrom being changed by exhalation, it is necessary that a mouth be closedover a period of a several minutes. It is, however, too stringent toimpose such a restrained condition on a suckling or an infant.Accordingly, it is difficult to precisely measure a body temperature.

In the case of rectal thermometry, hygienic management such assterilization of a thermometer is cumbersome. Accordingly, rectalthermometry is not suitable for body temperature measurement in ageneral household.

On the other hand, temperature measuring mode in an electronicthermometer includes an estimation mode and an actual measurement modeas described above. In the estimation mode, it is necessary to establisha uniform measuring condition by stabilizing a pressing force exerted onan electronic thermometer held under an armpit. In other words, if a gapunder the armpit or the pressing force exerted on the electronicthermometer held under the armpit is changed within a period for theestimation, the condition of heat transfer from a body surface to theelectronic thermometer is changed to cause a change in rate of measuredtemperature increase in the course of the measurement. Accordingly, itis difficult to effect precise calculation for the estimation.

In the case of the actual measurement mode, each of temperaturemeasurement, in which an electronic thermometer is held under an armpitunder stable pressing force without forming a gap under the armpit overa period of 5 minutes or longer, and temperature measurement, whichrequires that an electronic thermometer is sublingually and stably heldin a mouth while continuing nasal breathing, has been a hurdle toobtaining precise measurements.

Generally, an electronic thermometer indicates a measured temperature inpeak hold mode as its temperature indication. It is, however, necessaryto once reset the temperature indication after completion of temperaturemeasurement. Accordingly, such an electronic thermometer is not suitablefor monitoring a succession of subject body temperatures in real time.

Further, in a general type electronic thermometer, a measuredtemperature value is shown on a display of the thermometer. This imposesthe trouble of reading and recording a temperature indication every timea measured temperature is indicated on a user (a nurse mainly in aclinic or hospital).

With a view to solving the above-described problems, there has beedisclosed in Japanese Unexamined Patent Publication No. 133030/1988 anelectronic thermometer which comprises a flexible substrate, a batteryas an electric power source and a circuit element which are mounted onthe flexible substrate, and a flexible and heat-insulating coveringwhich covers other parts than a temperature detecting part.

In Japanese Unexamined Patent Publication No. 133030/1988, it has beenproposed as a means for saving the trouble of recording indicatedtemperatures to store temperature data, which is transmitted from anelectronic thermometer applied to a surface of a body, in a memory of anexternal device. In Japanese Unexamined Patent Publication No.133030/1988, however, a wire communication mode is employed in which thethermometer attached to a body surface and the external device areconnected by a cable, leading to poor manageability.

Further, in the electronic thermometer of Japanese Unexamined PatentPublication No. 133033/1988, presence of a battery as an electric powersource is always required in order to drive the circuit element, andevery time battery power is exhausted, it is consequently required toreplace an exhausted battery with another. Moreover, there is a problemthat when a battery is replaced, a stress is likely to be exerted onsoldered part in the circuit element because of the flexibility of thesubstrate to cause a failure.

Furthermore, when a battery is replaced, the covering having flexibilityand heat insulating properties is peeled. This poses a problem inrepeated use.

Still further, as means for outputting in the electronic thermometer ofJapanese Unexamined Patent Publication No. 133030/1988, there isemployed such a mode that a cable is externally connected to a fixedconnector provided on the flexible substrate. However, when the externalcable is connected to the fixed connector provided on the flexiblesubstrate attached to a body surface, a strong stress is likely to beexerted on the circuit element mounted on the flexible substrate tocause a failure. Further, it is easily supposable that if the externalcable is connected to and disconnected from the connector as often as atemperature is measured, it is easily supposable that possibility of afailure increases. On the other hand, in a case where the cable is leftconnected, if the cable is pulled, an excessive stress can be exerteddepending upon the condition of the pulling on the connector of theelectronic thermometer and a connector of the cable to cause a failureof the fitting therebetween. Accordingly, it is pointed out that thisconstitutes a major factor of a contact failure or the like.

A subject with the electronic thermometer of Japanese Unexamined PatentPublication No. 133030/1988 attached on a body surface thereof has suchan inconvenience that the subject's own freedom of movement isrestricted when the electronic thermometer is connected to an externalappliance by a cable. Further, the external appliance and the electronicthermometer are put in a one-to-one relationship to thereby lead to poorworking efficiency of the external appliance. On the other hand, if aplurality of input ports are provided with an external appliance and aplurality of electronic thermometers are connected thereto in parallel,cost of the external appliance per se is increased, and besides this,each of subjects has an inconvenience of being put under a furtherrestrained condition in order to prevent a plurality of cables frombeing entangled.

The electronic thermometer of Japanese Unexamined Patent Publication No.133030/1988 interiorly comprises an electric circuit, a temperaturedetecting part and a temperature measuring means, and further comprisesa battery as an electric power source and a fixing hardware for thebattery, an output connector, a covering having heat insulatingproperties and the like to form an integrated structure. The structureas a whole has many parts, and from the viewpoint of being a devicewhich is applied to a body surface in use, it has a problem ofincompatibility between thickness and flexibility Further, the largenessin number of the parts leads to cost increase. In view of this, thestructure has a hurdle in terms of as a disposable type.

Alternatively, if it is intended to output data from the temperaturemeasuring device to an external device by means of optical communicationand to receive the data by a phototransistor, absence of alight-intercepting object between the temperature measuring device as alight-emitting side and the external device as a light-receiving side isrequired. Accordingly, during temperature measurement with thetemperature measuring device applied to a body surface of a subject, thesubject is not permitted to cover the temperature measuring device withclothing or the like. It follows that the body surface and thetemperature measuring device are exposed to ambient air. In consequence,there is a critical problem that a temperature of the body surface isinfluenced by a temperature of the ambient air to hinder precisemeasurement of the body temperature of the subject.

If it is intended to measure a body temperature in real time with theelectronic thermometer of Japanese Unexamined Patent Publication No.133030/1988, it is required to align optical axes of the electronicthermometer as a light-emitting side and a light-receiving side byinserting an optical fiber for light reception into clothing and leadingto a vicinity of a connector for light-outputting of the bodytemperature measuring device with a body surface and the bodytemperature measuring device covered with the clothing. For thispurpose, a member for fixing the optical fiber for light reception tothe body temperature measuring device in some manner is required toresult in a complicated structure and cost increase. In this regard,even if the body temperature measuring device and the light-receivingside as a data-receiving side are not electrically connected, thisfiber-optic communication mode is not substantially different from awire communication mode so long as the optical fiber is present. In sucha fiber-optic communication mode, relationship between the bodytemperature measuring device and the data-receiving device is one-to-oneduring measurement, that is to say, the data-receiving device is used byonly a single subject. This gives rise to a problem of poor efficiency.

Further, the electronic thermometer of Japanese Unexamined PatentPublication No. 133030/1988 employs, as a means for detecting atemperature of a subject, a means in which a thermistor is brought intodirect contact with a body surface. However, if it is intended toperform temperature detection with a thermistor chip as a temperaturedata detecting means in direct contact with a skin as a body surface,stable contact with the surface of the flexible skin is not alwaysobtainable. Accordingly, it is impossible to effect precise measurementof a temperature of a subject.

The present invention has been made in view of the above-describedproblems inherent in the conventional techniques. It is, therefore, anobject of the present invention to provide a temperature measuringdevice and a temperature measuring method which are capable of obtainingprecise measured temperature values with respect even to old persons,sucklings or infants, which are capable of relieving troubles ofmonitoring and recording temperatures of subjects, which are simplyoperable and less susceptible to troubles to permit stable operation,which device comprises a small number of parts and may be formed into adisposable type according to need, which method is carried out by meansof such a device, and which enable precise temperature measurement inreal time.

DISCLOSURE OF INVENTION

The temperature measuring device disclosed in the present applicationcharacteristically comprises a flexible sheet which has its at least onesurface endowed with stickiness and which is provided with an openingand/or at least one hole, and a temperature data detecting means fordetecting a temperature of the inside of the opening and/or at least onehole.

A detecting part of the temperature data detecting means is preferablyso disposed as to be exposed to the inside of the opening and/or atleast one hole. At least one side of the opening and/or at least onehole is formed by the temperature measuring means, and a sealed airlayer is formed inside the opening and/or at least one hole by a subjectand the temperature data detecting means.

The temperature data detecting means preferably employs a means forconverting a temperature value into a frequency, and the temperaturedata detecting means is preferably accommodated in a space defined by apredetermined thickness of the flexible sheet.

The temperature data detecting means preferably employs a means forconverting a temperature value into a period, and the temperature datadetecting means is preferably accommodated in a space defined by apredetermined thickness of the flexible sheet.

The temperature data detecting means is preferably provided with abuilt-in A/D converter for A-to-D converting a resistance value orvoltage value in the form of an analog physical value, into which atemperature value has been converted, into a digital physical value.

A plurality of the openings and/or holes are provided. The temperaturemeasuring device may comprise an electromagnetic wave transmitting andreceiving means which cooperates with the temperature data detectingmeans. The electromagnetic wave transmitting and receiving means mayhave an inductively coupled means for receiving electromagnetic wavesfrom an external device. The inductively coupled means receives anelectromotive force from the external device through radio waves tosupply electric power to the temperature data detecting means. From thetemperature data detecting means, temperature data is radio-transmittedvia an antenna coil of the inductively coupled means to the externaldevice. The temperature data and an ID code are combined into a unit andradio-transmitted from the temperature data detecting means via theantenna coil to the external device.

A film-form control substrate with a system LSI chip mounted thereon ispreferably attached to an upper surface of the flexible sheet, and thetemperature data detecting means is preferably attached to an undersidesurface of the film-form control substrate in such a manner that thetemperature data detecting means is exposed to an air layer in theopening formed in the flexible sheet. An adhesive-applied sheet isattached to the flexible sheet to which the film-form control substrateis attached, and a space in the opening is thereby sealed. An air holeis formed at a predetermined position in the adhesive-applied sheet.Punched holes are formed in the adhesive-applied sheet. Theadhesive-applied sheet is attached to the flexible sheet to which thefilm-form control substrate is attached, and a space in the opening isthereby sealed, and a open-pore polytetrafluoroethylene is preferablyused for the adhesive-applied sheet and/or the film-form controlsubstrate and/or the flexible sheet to which the film-form controlsubstrate is applied. The temperature data detected by the temperaturedata detecting means is temperature data on a human body.

The temperature measuring method of the present invention comprisesproviding a flexible sheet with an opening and/or at least one hole,attaching the flexible sheet to a subject to thereby form an air layersealed by the opening and/or at least one hole, and measuring atemperature of the air layer by means of a temperature data detectingmeans. Temperature data detected by the temperature data detecting meansis stored in a memory provided on the flexible sheet, and thetemperature data stored in the memory is read out after removal of theflexible sheet from the subject. The subject may be a human body.

In the present invention, a human body is a major and significantsubject. Accordingly, the temperature measuring device and thetemperature measuring method of the present invention are extremelysuitably and conveniently used as a temperature measuring device and atemperature measuring method for a human body, i.e., a so-calledclinical thermometer and a so-called clinical thermometric method. Inview of this, the present invention will be described in detailhereinbelow centering the present invention on a case where thetemperature measuring device or the temperature measuring method of thepresent invention is applied to a human body. It is, however, to benoted that a subject to which the temperature measuring device or thetemperature measuring method of the present invention is applied is byno means restricted to a human body and that the subject includes all ofthose with respect to which the object of the present invention issignificantly achieved.

In the present invention, the temperature measuring device comprises aflexible sheet having its at least one surface endowed with stickinessand provided with an opening and/or at least one hole, and a temperaturedata detecting means for detecting a temperature of the inside of theopening and/or at least one hole; and the temperature measuring deviceis such an on-subject surface temperature measuring device that it isattached to a desired site of a subject and has a function ofradio-transmitting temperature data on the subject detected by thesubject temperature detecting means.

An external device supplies electric power through electromagnetic wavesto the on-subject surface temperature measuring device, and receives thetemperature data on the subject from the on-subject surface temperaturemeasuring device through radio waves, and subjects the temperature datato calculation with a CPU in the external device and with a functionformula written in a program to convert the temperature data into atemperature value of the subject, and indicates the temperature value.In other words, the on-subject surface temperature measuring device andthe external device are non-contact type energy and datatransmitting-receiving devices which are radio-coupled by means of anatural resonance frequency

The on-subject surface temperature measuring device is designed to becompact, lightweight and thin, and the on-subject surface temperaturemeasuring device per se is designed to have no electric source such as abattery but has a function of receiving electric power supply from theexternal device through radio waves. That is to say, when the on-subjectsurface temperature measuring device is brought into an area whichpermits radio-communication with the external device, electric power canbe radio-transmitted from the external device to activate the functionof the on-subject surface temperature measuring device.

When the on-subject surface temperature measuring device is actually inelectromagnetic communication with the external device, electric energyis electromagnetically supplied thereto. Accordingly, the on-subjectsurface temperature measuring device is able to have a batterylessstructure and can be formed into a compact, lightweight and thin sheet-or label-like structure. Further, the on-subject surface temperaturemeasuring device is free from battery replacement and thus can be usedsemipermanently as a thermometer. Since the on-subject surfacetemperature measuring device simply comprises a printed antenna coil andone chip or several chips as electronic parts, production cost cangreatly be reduced. This enables the on-subject surface temperaturemeasuring device to be used as a disposable one.

As a feature of the present invention, a flexible sheet having apredetermined thickness is provided with an opening, and to an uppersurface of the flexible sheet, a film-form and/or label-form substrateprovided with a control element and/or a CPU and/or an antenna coil anda temperature detecting means is so attached as to cover a space definedby the opening. Further, an adhesive material is applied to an undersidesurface of the flexible sheet having a predetermined thickness forapplying a temperature measuring device to a body surface or subject.With the temperature measuring device applied to the body surface orsubject, the space in the opening is sealed. A temperature of an airlayer in the sealed space is detected by the temperature data detectingmeans as a faithful and stable reflection of a temperature of the bodysurface or subject.

The above-described indirect mode of temperature detection with theinterposition of the air layer is effective for solving the problemsinherent in the conventional temperature measuring devices, particularlyclinical thermometers. This is because it is possible by the indirectmode to eliminate inaccuracy-causing factors in measurement oftemperatures, which would cause variations in results if temperaturedata detecting means were directly applied to body surfaces by themedium of the adhesive material, due to irregularities dependent uponproducts in application thicknesses of the adhesive material, or changesin quantities of heat conducted from subject body surfaces attributableto changes in adhesion or the like in the course of uses afterapplications to the body surfaces, thereby enabling stable and precisetemperature measurement.

Further, if a mode in which a temperature data detecting device isbrought into direct contact with a skin and attached to the body surfaceby means of medical tape or the like is employed, there is still aproblem that precise measurement of temperatures of subjects cannot beeffected because stable contacts with flexible skin surfaces cannot beconstantly be obtained with respect to an electronic thermometer ofJapanese Unexamined Patent Publication No. 133030 or an electronicthermometer having a rod-like shaped temperature detecting part.

Therefore, the above-described indirect mode of temperature detectionwith the interposition of the air layer is a temperature measuring modewhich is capable of solving the above-described problem of thedestabililzing factors, i.e., inaccuracy-causing factors.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is an overall schematic view of a temperature measuring system towhich a first embodiment of the temperature measuring device accordingto the present invention is applied.

FIG. 2 is an overall schematic view schematically representing thetemperature measuring system, to which the first embodiment shown inFIG. 1 of the temperature measuring device is applied, into functionalblocks.

FIG. 3 is a sectional side view of the on-subject temperature measuringdevice.

FIG. 4 is a representation illustrating a process of planarly formingthe on-subject temperature measuring device in the temperature measuringsystem to which the first embodiment of the temperature measuring deviceis applied.

FIG. 5 is a representation illustrating a process of coplanarly formingthe on-subject temperature measuring device in the temperature measuringsystem to which the first embodiment of the temperature measuring deviceis applied.

FIG. 6 is a representation illustrating a process of coplanarly formingthe on-subject temperature measuring device in the temperature measuringsystem to which the first embodiment of the temperature measuring deviceis applied.

FIG. 7 is a representation illustrating a process of coplanarly formingthe on-subject temperature measuring device in the temperature measuringsystem to which the first embodiment of the temperature measuring deviceis applied.

FIG. 8 is a representation illustrating a process of coplanarly formingthe on-subject temperature measuring device in the temperature measuringsystem to which the first embodiment of the temperature measuring deviceis applied.

FIG. 9 is a representation illustrating a process of coplanarly formingthe on-subject temperature measuring device in the temperature measuringsystem to which the first embodiment of the temperature measuring deviceis applied.

FIG. 10 is a flow chart of a temperature measuring process in thetemperature measuring system to which the first embodiment of thetemperature measuring device is applied.

FIG. 11 is a flow chart of a temperature measuring process in thetemperature measuring system to which the first embodiment of thetemperature measuring device is applied.

FIG. 12 is a flow chart of a temperature measuring process in thetemperature measuring system to which the first embodiment of thetemperature measuring device is applied.

FIG. 13 is a flow chart of a temperature measuring process in thetemperature measuring system to which the first embodiment of thetemperature measuring device is applied.

FIG. 14 is a flow chart of a temperature measuring process in thetemperature measuring system to which the first embodiment of thetemperature measuring device is applied.

FIG. 15 is a bottom view of a third embodiment of the temperaturemeasuring device.

FIG. 16 is a bottom view of another form of the third embodiment of thetemperature measuring device.

FIG. 17 is a bottom view of still another form of the third embodimentof the temperature measuring device.

FIG. 18 is a sectional side view of the on-subject temperature measuringdevice of the temperature measuring system according to the presentinvention.

FIG. 19 is a sectional side view of the on-subject temperature measuringdevice of the temperature measuring system according to the presentinvention.

FIG. 20 is a sectional side view of the on-subject temperature measuringdevice of the temperature measuring system according to the presentinvention.

FIG. 21 is a sectional side view of the on-subject temperature measuringdevice of the temperature measuring system according to the presentinvention.

FIG. 22 is a sectional side view of the on-subject temperature measuringdevice of the temperature measuring system according to the presentinvention, including a plurality of openings 20.

BEST MODE FOR CARRYING OUT THE INVENTION FIRST EMBODIMENT

FIG. 1 is an overall schematic view of a temperature measuring system towhich a first embodiment of the temperature measuring device accordingto the present invention is applied.

Referring to FIG. 1, an on-subject temperature measuring device 1 as atemperature measuring device, which is attached to a subject when atemperature of the subject is measured, receives a radio wave from areader 2 as an external device and is thereby electrically powered. Bymeans of the electric power, temperature measurement is performed in theon-subject temperature measuring device 1. The results of themeasurement are transmitted through radio waves to the reader 2 as atemperature of the subject and ID data. The reader 2 is so constructedas to be connectable to a personal computer (not shown), and dataprocessing by the personal computer is performed according to need.

FIG. 2 is an overall schematic view schematically representing thetemperature measuring system, to which the first embodiment shown inFIG. 1 of the temperature measuring device is applied, into functionalblocks. As shown in FIG. 2, the reader 2 comprises a reader bodyprovided with an antenna coil 3, and radio waves are sent and receivedthrough the antenna coil 3 between the reader 2 and the on-subjecttemperature measuring device 1 provided with a film antenna coil 4.

As shown in the FIG., an electromotive force is supplied by means of aradio wave from the reader 2 through the antenna coil 3 to theon-subject temperature measuring device 1. On the other hand, from theon-subject temperature measuring device 1, the temperature data istransmitted by means of a radio wave to the reader 2.

As shown in the FIG., the reader 2 is equipped with a system LSI 5 andhas a power circuit 6 for supplying driving electric power, a radio waveinterface 7 for inputting radio signals from and outputting radiosignals to the antenna coil 3, a clock circuit 8 for generating areference clock signal, an inductively coupled circuit 9 for inputtingelectromagnetic signals from and outputting electromagnetic signals tothe radio wave interface 7, a liquid crystal display 10 for displayingtemperature measurement results and the like, and an external applianceconnecting circuit 11 for connecting the reader 2 to an externalappliance (not shown).

The system LSI comprises an interface 5 a, an A/D-D/A converter 5 b, aRAM 5 c, a ROM 5 d, a CPU 5 e and an EEPROM 5 f. The reader 2 isconstructed to be of such a handy type that the above-mentioned antennacoil 3 receives an ID code of the on-subject temperature measuringdevice 1, temperature data and a thermistor characteristics ID, and thereceived data is processed and the processed data is stored in thesystem LSI 5, and the processed data is shown on the liquid crystaldisplay 10. The reader 2 by itself can sequentially scan radio wavesfrom a plurality of on-subject temperature measuring devices 1 to readin the radio waves, and the data is stored in the RAM 5 c as internalmemory of the reader 2 in the form of data units each of which iscomposed of an ID code of an on-subject temperature measuring device 1,temperature data and a thermistor characteristics ID, and then the datais calibrated and IDs of the on-subject temperature measuring devices 1and values of measured temperatures are shown on the display 10.Alternatively, the reader 2 may be connected to an external appliance(not shown) such as a personal computer, and the data once stored in thereader 2 is en bloc transmitted to the personal computer to process thetemperature data and the ID codes of the on-subject temperaturemeasuring devices 1.

Since the reader 2 performs high speed scanning of the temperature datawhile recognizing the ID codes of the on-subject temperature measuringdevices 1 when the reader receives the data, the reader 2 is capable ofreading in the data on the plurality of the on-subject temperaturemeasuring devices 1 almost instantaneously.

On the other hand, as shown in the FIG., the on-subject temperaturemeasuring device 1 is equipped with a system LSI chip 12 and comprises aradio wave interface 13 for inputting signals from and outputtingsignals to a film antenna coil 4, a temperature detecting part 14, andan inductively coupled circuit 15 for inputting signals from andoutputting signals to the radio wave interface 13. The LSI chip 12,which inputs signals from and outputs signals to the temperature sensingsection 14 and the radio wave interface 13, comprises an interface 12 a,an A/D converter 12 b for detecting a temperature-dependent resistanceof the temperature detecting part 14 and converting the detectedtemperature-dependent resistance into written data, a RAM 12 c, a ROM 12d, a CPU 12 e and an EEPROM 12 f.

The above-mentioned temperature detecting part 14 comprises atemperature data detecting means 16 and a sealed air layer 17.

FIG. 3 is a sectional side view of the above-mentioned on-subjecttemperature measuring device 1. Referring to FIG. 3, the system LSI chip12 is mounted on an upper surface of a film-form control substrate 18,and the film-form control substrate 18 is attached to an upper surfaceof a nonwoven fabric 19 having a predetermined thickness as a flexibleseat, and a chip thermistor 22 is attached to the reverse surface of theabove-mentioned film-form control substrate 18 in such a manner that thechip thermistor is exposed to an air layer 21 in an opening 20 formed inthe nonwoven fabric 19 having a predetermined thickness. To the reversesurface of the nonwoven fabric 19 having a predetermined thickness, anadhesive material 23 for attaching the on-surface temperature measuringdevice 1 to a surface of a subject body is applied.

The nonwoven fabric 19 having a predetermined thickness attached to thesurface of the subject body provides a space defined by the opening 20centrally formed in the nonwoven fabric 19 to thereby provide the airlayer 21 having a thickness approximately corresponding to thepredetermined thickness of the nonwoven fabric between the surface ofthe subject body and the reverse surface of the film-form controlsubstrate 18.

As described above, the reverse surface of the nonwoven fabric 19 issuch that the adhesive material 23 is applied to the portion thereofwhich is other than and surrounds the opening 20. Accordingly, when theon-subject temperature measuring device 1 is attached to the surface ofthe subject body, the air layer 21 is confined in the space defined bythe opening 20 and sealed from ambient air. A temperature of the airlayer 21 isolated from ambient air is not substantially influenced by atemperature of ambient air and is thus capable of straight reflecting atemperature of the surface of the subject body. The chip thermistor 22is so disposed as to be directly exposed to the air layer 21.

The indirect mode of the temperature detection with the interposition ofthe air layer 21 is able to eliminate destabilizing factors inmeasurement of temperatures of subjects, which would cause variations inresults if temperature data detecting means were directly applied tosurfaces of the subject bodies by the medium of the adhesive material23, due to irregularities dependent upon products in thicknesses of theapplied adhesive material 23, or due to changes in quantities of heatconducted from subject body surfaces attributable to changes in adhesionor the like in the course of uses after applications to the subject bodysurfaces, or due to other causes. Further, a mode in which a temperaturedata detecting device is brought into direct contact with a skin bymeans of medical tape or the like is not capable of precisely measuringtemperatures of subjects because stable contacts with flexible skinsurfaces cannot constantly be obtained, whereas the above-described modewhich indirectly measures temperatures via the sealed air layer 21 iscapable of measuring temperatures precisely and stably.

As the temperature data detecting means located in the space defined bythe opening 20 of the nonwoven fabric 19 having a predeterminedthickness as described above, there may be used a means to convert atemperature value into a resistance value. Besides the above-mentionedchip thermistor 22, such a means to convert a temperature value into aresistance value may be a thermistor pattern printed on the film-formcontrol substrate 18 or a platinum resistance temperature sensor. Inthis case, a thinner resistance temperature sensor chip should beattached to the reverse surface of the film-form control substrate toform a such a structure that the temperature sensor chip is preventedfrom being brought into direct contact with the surface of the subjectbody such as a skin.

As the temperature data detecting means located in the space defined bythe opening 20 of the nonwoven fabric 19 having a predeterminedthickness, there may also be employed a means to convert a temperaturevalue into a voltage value. As the means to convert a temperature valueinto a voltage value, a thermoelectric couple utilizing Seebeck effect,a PN device or PN diode utilizing Peltier effect, or an IC chipexhibiting a voltage output proportional to a temperature may be placedin the space defined by the opening 20 of the nonwoven fabric 19 havinga predetermined thickness.

As the temperature data detecting means located in the space defined bythe opening 20 of the nonwoven fabric 19 having a predeterminedthickness, there may further be employed a means to convert atemperature value into a frequency. As the means to convert atemperature value into a frequency, there may be placed in the spacedefined by the opening 20 of the nonwoven fabric 19 having apredetermined thickness, a chip IC for further converting the physicalvalue into which the temperature value has been converted, i.e., theabove-mentioned resistance value or voltage value into a frequency bymeans of a multivibrator circuit, an oscillating circuit or a V-Fconverter to thereby transmit the frequency signal directly to thereader 2 as an external device without intermediary of an A/D converter.

As the temperature data detecting means located in the space defined bythe opening 20 of the nonwoven fabric 19 having a predeterminedthickness, there may further be employed a means to convert atemperature value into a period of time. As the means to convert atemperature value into a time period, there may be placed in the spacedefined by the opening 20 of the nonwoven fabric 19 having apredetermined thickness, a chip IC for further converting theabove-mentioned signal resulting from the conversion into a time periodor a pulse duration.

Moreover, as the temperature data detecting means, a LSI chip with abuilt-in A/D converter for A-to-D converting the analog physical valueinto which the temperature value has been converted, i.e., theabove-mentioned resistance value or voltage value into a digital signalmay be placed in the space defined by the opening 20 of the nonwovenfabric 19 having a predetermined thickness.

As described above, the film-form control substrate 18 is equipped withthe system LSI chip 12 including a CPU chip and a memory IC or includinga CPU and a memory IC.

In the memory IC, there is stored data for calibrating a differenceamong individuals in conversion characteristics which develops when atemperature value of a subject is converted into any of a resistancevalue, voltage value, frequency, time period, duration or the like.

The film-form control substrate 18 is provided with the inductivelycoupled circuit 15 which generates electric power by the exposure toradio wave energy from the reader 2. The inductively coupled circuit 15is provided with the film antenna coil 4 for receiving the radio waveenergy from the reader 2 as an external device.

The film-form control substrate 18 is provided with the chip thermistor22 or a film-type thermistor (R th) which is formed by patterningcoplanarly with the inductively coupled circuit 15 having the filmantenna coil 4. In this way, by the exposure to the radio wave energyfrom the reader 2 as an external device via the film antenna coil 4, theelectromagnetic induction coupled circuit 15 induces an induced voltageto generate electric power. Accordingly, the thermometer on-subjecttemperature measuring device 1 of the present invention per se is notrequired to be provided with an electric source and so constructed as tohave no battery.

In the first embodiment, an NTC thermistor is used as the temperaturedata detecting means. Preliminarily in preparation stage of each ofon-subject temperature measuring devices 1, pieces oftemperature-to-resistance conversion data on an NTC thermistor withrespect to different temperatures in a referential range between 32° and42° are sequentially stored in a virgin memory in a thermostatic chamberpreliminarily at a stage of production of each on-subject temperaturemeasuring device 1, the stored data is used as an intrinsic thermistorcharacteristics ID of each on-subject temperature measuring devices 1.

In the first embodiment, with a view to reducing a capacity of eachmemory with which each of the on-subject temperature measuring devices 1is equipped, the memory is provided with no function formula forperforming the calibration at the on-subject temperature measuringdevice's end. However, if the capacity of the memory allows storage ofthe function formula and results of calibration, an individualdifference in temperature-to-resistance conversion characteristics ofeach chip thermistor 22 may be calibrated to store the results in theEEPROM 12 f.

On the other hand, the reader 2 is provided with representative valuesof the data on the temperature-to-resistance conversion characteristicsof the thermistors. This representative value data serves as referentialdata with respect to thermistor conversion data on all the on-subjecttemperature measuring devices 1. Further, based on the referential data,a fundamental function formula is preliminarily written as a mask ROM ina memory of each reader 2 as an external device in the course ofpreparation of each reader 2.

In practical temperature measurement of a subject, the measuredtemperature data and the thermistor characteristics ID are transmittedin the form of combined data or separately in a time-divisional mannerfrom the on-subject temperature measuring device 1 to the reader 2 as anexternal device. The reader 2 stores the measured temperature data andthe thermistor characteristics ID, which have been received through theradio waves, once in the RAM 5 c.

The thermistor characteristics ID is assigned to the fundamentalfunction formula which has preliminarily been stored in the reader 2 tocreate a new temperature conversion function formula. Further, themeasured temperature data is assigned to the thus created temperatureconversion function formula to thereby determine the temperature?.

In the first embodiment of the thermometer on-subject temperaturemeasuring device 1, the film antenna coil 4, the film type thermistorand the CPU are provided substantially coplanarly on of one film-formcontrol substrate 18. However, it is not necessary that these members beprovided substantially coplanarly. According to another form, it ispossible to employ such a structure that the film antenna coil 4, thefilm type thermistor and the CPU chip or film type CPU are disposed in alaminated multilayer manner.

For construction of the on-subject temperature measuring device 1 usedin the temperature measuring system to which the first embodiment of thetemperature measuring device is applied, there will be described below aprocess for providing the film antenna coil 4, the chip thermistor 22(film type thermistor) and the system LSI chip 12 substantiallycoplanarly on one film-form control substrate 18.

As shown in FIG. 4, first, on a left area of a surface of the film-formflexible control substrate 18, the inductively coupled circuit 15including the film coil antenna 4 and the system LSI chip 12 aredisposed, and on a right area of the same surface of the film-formflexible control substrate 18, the chip thermistor 22 is mounted.Instead of the chip thermistor 22, a thermistor pattern 22 a may beprinted as shown in FIG. 5.

Then, as shown in FIG. 6, the film-form flexible control substrate 18 isso bent as to dispose the chip thermistor 22 or thermistor pattern 22 aon the reverse surface relative to the upper surface of the film-formflexible control substrate 18 on which the system LSI chip 12 isdisposed. In this manner, by constructing such a single-sided substratethat wiring pattern is printed on the same surface of the film-formflexible control substrate 18 on which the other parts are provided tothereby provide all the electronic parts on the same surface of thefilm-form flexible control substrate 18, it is possible to economicallyprepare the substrate. This leads to economical preparation of theon-subject temperature measuring device.

Subsequently, as shown in FIG. 7, the film-form flexible controlsubstrate 18 is attached to a nonwoven fabric 19 having a predeterminedthickness in such a manner that the chip thermistor 22 or thermistorpattern 22 a is placed in a space which is defined by an opening 20 ofthe nonwoven fabric 19 and which has a depth substantially correspondingto the predetermined thickness of the nonwoven fabric 19. The chipthermistor 22 is thereby exposed to the space defined by the opening 20of the nonwoven fabric 19 as shown in FIG. 8, or the thermistor pattern22 a is likewise exposed to the space defined by the opening 20 of thenonwoven fabric 19 as shown in FIG. 9.

In the following, a temperature measuring process by means of thetemperature measuring system to which the first embodiment of thetemperature measuring device applied will be described with reference toflowcharts shown in FIGS. 10 to 14.

At the beginning of measurement, the on-subject temperature measuringdevice 1 is first applied to a surface of a subject body. Then, atemperature of the surface of the subject body is changed underinfluence of ambient air due to taking off clothing. However, by puttingthe clothing over the on-subject temperature measuring device 1, returnof the temperature of the subject body surface which has been changedunder influence of the ambient air begins. When a prescribed period oftime for the return of the temperature of the subject body elapses, thetemperature of the surface of the subject body in the clothing becomesstable to reach completion of the return of the temperature of thesubject body. Consequently, a temperature of the sealed air layer 17 ofthe on-subject temperature measuring device 1 becomes stable. Then, thereader 2 as an external device is switched on, and an electromagneticwave is thereby emitted from the reader 2. The reader 2 in thiscondition is brought nearer to the clothing. When the reader is broughtwithin an electromagnetic inductive coupling distance which permits theinductively coupled circuit 15 of the on-subject temperature measuringdevice 1 to function, electric power is generated in the inductivelycoupled circuit 15 to actuate the on-subject temperature measuringdevice 1. In consequence, a standby signal as a response is transmittedfrom the radio wave interface 13 of the on-subject temperature measuringdevice 1 to the reader 2 as an external device. In response thereto, acommand signal requesting the sensor-specific data (thermistor-specificcharacteristics ID) is transmitted from the reader 2 to the on-subjecttemperature sensing device 1 (in a case where the sensor-specific dataand the temperature data are time-divisionally transmitted). By request,the on-subject temperature measuring device 1 transmits thesensor-specific data with respect to the different referentialtemperatures, which has preliminarily been factory-stored in the EEPROM12 f included in the on-subject temperature measuring device 1, to thereader 2 as an external device via the radio wave interface 13. Thesensor-specific data (thermistor-specific characteristics ID) which hasbeen modulated and radio-transmitted to the reader 2 as an externaldevice is demodulated by the radio wave interface 7 in the reader 2 andinputted in the interface 5 a of the system LSI 5. The sensor-specificdata is assigned to the fundamental function formula stored in the ROM 5d of the reader 2 as an external device, and a new sensor-specificfunction formula is created by the CPU 5 e of the reader 2 as anexternal device.

The newly created function formula is stored in the RAM 5 c of thereader 2 as an external device. Temperature determinations subsequentthereto are carried out by means of the newly created function formula.

Then, a command requesting temperature data is transmitting from thereader 2 as an external device to the on-subject temperature measuringdevice 1, and the chip thermistor 22, which is so disposed as to beexposed to the sealed air layer 17 and to thereby constitute thetemperature sensing part 14 of the on-subject temperature measuringdevice 1, initiates temperature detection. A resistance value of thechip thermistor which is derived from the measured temperature of thesubject is converted into a voltage value in the temperature sensingpart 14, and the voltage value is inputted into the interface 12 a ofthe system LSI 12. The system LSI 12 of the on-subject temperaturemeasuring device 1 subjects the inputted analog voltage value to A-to-Dconversion, and the resulting digital temperature data is stored in theRAM 12 c. Then, the temperature data stored in the RAM 12 c of thesystem LSI 12 of the on-subject temperature measuring device 1 ismodulated into a radio signal via the radio wave interface 13, the radiosignal is transmitted from the film antenna coil 4 to the reader 2 as anexternal device.

In the reader 2 as an external device, the temperature data which hasbeen modulated and radio-transmitted thereto is demodulated by the radiowave interface 7 and inputted in the interface 5 a of the system LSI 5.

The temperature data transmitted from the on-subject temperaturemeasuring device 1 is assigned to the newly created function formulastored in the RAM 5 c of the reader 2 as an external device, and anoperation is performed in CPU 5 e to obtain a value of the measuredtemperature.

In each temperature determination as described above, temperaturestability of the sealed air layer 17 is checked. Specifically, a rate oftemperature change is calculated in the CPU 5 e of the reader 2 as anexternal device. If the result of the calculation is not a rate oftemperature change within a prescribed value range, temperaturestability of the sealed air layer 17 is checked repeatedly until a rateof temperature change as a result of calculation in the CPU 5 e becomesone within the prescribed value range. If a rate of temperature changeas a result of calculation in CPU 5 e is one within the prescribed valuerange, a peak value of the temperature which has changed within theprescribed value range is stored in the RAM 5 c of the reader 2 as anexternal device. Then, such temperature determination procedure isperformed repeatedly until a prescribed determination time elapses. Onlapse of the prescribed temperature determination time, a measuredtemperature value of the subject is shown on the liquid crystal display10 of the reader 2 as an external device. The data is stored in theEEPROM 5 f of the system LSI 5 of the reader 2 as an external device,and the reader 2 as an external device is switched off to therebyterminate the temperature determination.

In the embodiment described above with reference to the flow charts, thechip thermistor 22 is used as a sensor of the temperature sensing part14, and the sealed air layer 17 is described as a single sealed airlayer. However, the present invention is not restricted to such a form.If a plurality of sealed air layers 17 are provided, sensor-specificinformation data of each of sensors placed in the respective sealed airlayers 17 is transmitted to the reader 2 as an external device. Thereader 2 as an external device creates, using the fundamental functionformula stored in the ROM 5 d, new function formulas of the same numberas the sensors. In such a case where a plurality of new functionformulas are created, an ID is allotted to each of the sensors and theID is paired with the corresponding new function formula. In the abovedescription, the new function formulas are created in the reader 2.However, new function formulas may be factory-created in calibrationprocedure and factory-stored in the EEPROM 12 f in the on-subjecttemperature measuring device 1. In this case, in actual temperaturedetermination, operation is conducted in CPU 12 e of the on-subjecttemperature measuring device 1 to calculate a temperature of thesubject, and the result is transmitted to the reader 2 and shown on theliquid crystal display 10 of the reader 2.

SECOND EMBODIMENT

In a temperature measuring system to which a second embodiment of thetemperature measuring device according to the present invention isapplied, a circuit element of an on-subject temperature measuring device1 comprises no CPU or A/D converter, as different from the firstembodiment. Instead thereof, an oscillation circuit is provided forproducing oscillations with frequencies proportional to resistancevalues of a chip thermistor or film type thermistor, and a radio wavewith such an oscillation frequency or a period (pulse width) of thefrequency is directly transmitted as data to a reader 2 as an externaldevice, and the frequency or period is converted into temperature databy a software in the external device. In this embodiment, the circuitryis simplified. This enables the temperature measuring system to be oneto which such an inexpensive temperature measuring device is applied.

THIRD EMBODIMENT

FIG. 15 is a bottom view of a third embodiment of the on-subjecttemperature measuring device according to the present invention. FIG. 16is a bottom view of another form of the third embodiment of thetemperature measuring device according to the present invention. FIG. 17is still another form of the third embodiment of the temperaturemeasuring device according to the present invention. Difference betweenthe third embodiment and the first embodiment resides in that a sheet 24with an adhesive is used in the third embodiment of the temperaturemeasuring device, and the sheet 24 with an adhesive is applied to anonwoven fabric 19 which is attached to a film-form control substrate18, and a space within an opening 20 of the nonwoven fabric 19 isthereby sealed as shown in the FIGS. In the form shown in FIG. 15, arectangular air communication hole 25 is provided at a predeterminedposition of the sheet 24 with an adhesive. The air communication hole 25may be circular. In the form shown in FIG. 16, a plurality of aircommunication apertures 26 a, 26 b, 26 c, 26 d, 26 e are provided in anarea, which substantially corresponds to the opening 20 to which thefilm-form control substrate 18 is applied, of the sheet 24 with anadhesive. In the form shown in FIG. 17, punched perforations 27 a, 27 b,27 c, 27 d, 27 e are formed all over the sheet 24 with an adhesive.

FOURTH EMBODIMENT

FIG. 18 is a sectional side view of a fourth embodiment of theon-subject temperature measuring device 1 of the temperature measuringsystem according to the present invention, wherein a sheet of a porouspolytetrafluoroethylene of which pores are in communication with eachother (,i.e., open-pore polytetrafluoroethylene) is used as a sheet 24with an adhesive. As in the case of each of the above-describedembodiments, a system LSI chip 12 is mounted on an upper surface of afilm-form control substrate 18. Differently from each of theabove-described embodiments, however, the film-form control substrate 18is attached to an upper surface of a urethane (foamed material) or cork(heat insulating material) sheet 29. To the reverse surface of theurethane (foamed material) or cork (heat insulating material) sheet 28,the adhesive-applied sheet 24 made of an open-porepolytetrafluoroethylene is applied. As shown in the FIG., a spacedefined by an opening 20 centrally formed in the urethane (foamedmaterial) or cork (heat insulating material) sheet 28 provides an airlayer 21 having a thickness approximately corresponding to apredetermined thickness of the urethane (foamed material) or cork (heatinsulating material) sheet 29 between the adhesive-applied sheet 24 andthe reverse surface of the film-form control substrate 18.

The above-mentioned open-pore polytetrafluoroethylene is characterizedin that it is prepared by orientation so as to have an open-porestructure. As a starting material, a polytetrafluoroethylene (PTFE) isused. A fine powder of a PTFE is compacted and uniaxally or biaxiallyoriented at a high temperature at a high speed to prepare an open-porepolytetrafluoroethylene. When orientation in two directions (biaxialorientation) is conducted, the resultant has a biaxially orientedstructure which has granular nodes and radially extending fibrils. Poresof the open-pore polytetrafluoroethylene are not individually presentbut in communication with each other in all directions to form anopen-pore structure of which pores do not come to the end inside thestructure. Accordingly, the open-pore polytetrafluoroethylene has astructure of open-pore profile. The open-pore polytetrafluoroethylenehas no substantial hydrophilicity or water absorption properties butshows high water repellency because of its high contact angle withwater. Further, the open-pore polytetrafluoroethylene allows no liquidhaving high surface tension such as water to penetrate but has moisturepermeability which allows water vapor transmission, and yet, it has alow intermolecular cohesive force and thus has an extremely lowfrictional resistance. Moreover, since the open-porepolytetrafluoroethylene is prepared by highly orienting apolytertafluoroethylene with an ultrahigh molecular weight, it isextremely though as a porous structure and has excellentbiocompatibility to cause no substantial foreign-body reaction and hasno toxic danger, carcinogenic danger or the like. Furthermore, theopen-pore polytetrafluoroethylene undergoes no particular degradation ordeterioration in a living body in vivo and is well permeable to gasesbecause its pores, which provide the porous structure, are incommunication with each other. In this connection, the gas permeabilitymay freely be controlled by controlling pore size or porosity. Further,although the open-pore polytetrafluoroetylene has properties ofnonadhesiveness and easy-releasability, it may be mechanically attachedto a subject by anchor effect obtained by pressure-injecting an adhesiveinto pores. In addition, the open-pore polytetrafluoroethylene has adielectric constant which is lower than that of a solidpolytetrafluoroethylene because of its porous structure and which is thelowest among those of all solids, and thus it has excellent signaltransmitting properties and high frequency insulating properties. Stillfurther, the open-pore polytetrafluoroethylene may be used up to 260°,and it maintains its flexibility even at a temperature as low as −200°.

FIG. 19 is a bottom view of the fourth embodiment of the on-subjecttemperature measuring device 1 according to the present invention. Inother words, FIG. 19 is a plan view of a surface, which is to be appliedto a subject, of the fourth embodiment. As shown in the FIG., theadhesive-applied sheet 24 obtained by employing the open-porepolytetrafluoroethylene has a site corresponding to the air layer 21,i.e., a gas permeation site 24 a and an area other the site, i.e., abiaxially oriented two-direction stretchable area 24 b. The biaxiallyoriented two-direction stretchable area 24 b has stretchability in thedirections shown by arrows in the FIG.

FIFTH EMBODIMENT

Each of FIGS. 20 and 21 is a sectional side view of a fifth embodimentof the on-subject temperature measuring device 1 of the temperaturemeasuring system according to the present invention, which embodiment isconstructed such that a open-pore polytetrafluoroethylene is used for afilm-form control substrate 18 and a flexible sheet 29 to which thefilm-form control substrate 18 is attached as well as anadhesive-applied sheet 24 and that as in the case of each of theabove-described embodiments, a system LSI chip 12 is mounted on an uppersurface of the film-form control substrate 18.

In the fifth embodiment of the on-subject temperature measuring device1, since an open-pore polytetrafluoroethylene is used for the film-formcontrol substrate 18 and the flexible sheet 29 to which the film-formcontrol substrate 18 is attached as well as the adhesive-applied sheet24, heat retaining properties and moisture permeability in thedirections shown by arrows in FIG. 21 are ensured. Accordingly, when theon-subject temperature measuring device 1 is attached to a subject, itcauses no particular discomfort and thus enables comfortable use.

INDUSTRIAL APPLICABILITY

The present invention relates to a temperature measuring device which,in temperature measurement, is driven without a battery and wirelesslytransmits temperature data. Particularly, by virtue of the preliminaryattachment of the temperature measuring device to a surface of asubject, a temperature of the subject can be measured instantaneouslyand precisely by means of an external device through radio waves whentemperature measurement is needed. Accordingly, even if the subject ismoving, temperature measurement can be carried out in real timesuccessively.

In particular, in a case where a subject is a human body, thetemperature measuring device has preliminarily been attached to asurface of the human body, thereby allowing a surface temperature of thehuman body to have become stable and enabling the surface temperature tobe measured instantaneously and precisely from the outside of clothingwhen temperature measurement is needed. By virtue of this, even if thehuman body as a subject is moving or the person as a subject issleeping, temperature measurement can be carried out in real timesuccessively without restraint. Accordingly, the present invention issuitable for measuring temperatures of infants who moves restlessly orold persons whose axillary pits have enlarged. Further, if a subject issleeping, a body temperature of the subject can be measured as occasionarises without being noticed by the subject.

The subject whose temperature is measured by the present invention isnot restricted to a human body but includes a temperature of a generalroom, goods which are being transported, a temperature of a wine cellar,a temperature of a liquid in a reservoir and the like. With respect tosubjects at temperatures in a range between about −50° to about 250° inwhich a temperature measuring element can operate, the temperatures ofthe subjects can be measured directly. With respect to subjects attemperatures without the range of about −50° to about 250°, thetemperatures of the subjects can generally be measured if thetemperatures of the subjects are subjected to attenuation or compressionto indirectly measure the temperatures.

1. A temperature measuring device comprising: a flexible sheet havingits one surface endowed with stickiness for application to a surface ofa subject, said flexible sheet being provided with an opening; and atemperature data detecting means for detecting a temperature of theinside of the opening, wherein a detecting part of the temperature datadetecting means is so disposed as to be exposed to the inside of theopening with nothing but an air layer between the surface of the subjectand an opposing surface of the detecting part.
 2. The temperaturemeasuring device according to claim 1, wherein the temperature datadetecting means employs a means for converting a temperature value intoa frequency, and wherein the temperature data detecting means isaccommodated in a space defined by a predetermined thickness of theflexible sheet.
 3. The temperature measuring device according to claim1, wherein the temperature data detecting means employs a means forconverting a temperature value into a period, and wherein thetemperature data detecting means is accommodated in a space defined by apredetermined thickness of the flexible sheet.
 4. The temperaturemeasuring device according to claim 1, wherein the temperature datadetecting means is provided with a built-in A/D converter for A-to-Dconverting a resistance value or voltage value in the form of an analogphysical value, into which a temperature value has been converted, intoa digital physical value.
 5. The temperature measuring device accordingto claim 1, wherein one side of the space formed in the opening isdefined by the temperature data detecting means, and the other side ofthe space is defined by a surface of a subject, and a sealed layer isthereby formed between the subject and the temperature data detectingmeans.
 6. The temperature measuring device according to claim 1, whereina plurality of the openings are provided.
 7. The temperature measuringdevice according to claim 1, wherein temperature data detected by thetemperature data detecting means is temperature data on a human body. 8.The temperature measuring device according to claim 1, wherein saiddetecting part is arranged in said opening so as to be set apart from asubject being measured via an air layer when the temperature measuringdevice is attached to the subject.
 9. The temperature measuring deviceaccording to claim 1, wherein the detecting part comprises a chipthermistor which is directly exposed to the inside of the opening. 10.The temperature measuring device according to claim 1, which is capableof measuring the temperature of the subject under the condition wherenothing but an air layer is present between the surface of the subjectand an opposing surface of the detecting part.
 11. The temperaturemeasuring device according to claim 1, wherein a film-form controlsubstrate with a system LSI chip mounted thereon is attached to an uppersurface of the flexible sheet, and the temperature data detecting meansis attached to an underside surface of the film-form control substratein such a manner that the temperature data detecting means is exposed toan air layer in the opening formed in the flexible sheet.
 12. Thetemperature measuring device according to claim 11, wherein theadhesive-applied sheet is attached to the flexible sheet to which thefilm-form control substrate is attached, and a space in the opening isthereby sealed, and wherein an open-pore polytetrafluoroethylene is usedfor the adhesive-applied sheet and/or the film-form control substrateand/or the flexible sheet to which the film-form control substrate isapplied.
 13. The temperature measuring device according to claim 11,wherein an adhesive-applied sheet is attached to the flexible sheet towhich the film-form control substrate is attached, and a space in theopening is thereby sealed.
 14. The temperature measuring deviceaccording to claim 13, wherein an air hole is formed at a predeterminedposition in the adhesive-applied sheet.
 15. The temperature measuringdevice according to claim 13, wherein punched holes are formed in theadhesive-applied sheet.
 16. The temperature measuring device accordingto claim 1, comprising an electromagnetic wave transmitting andreceiving means which cooperates with the temperature data detectingmeans.
 17. The temperature measuring device according to claim 16,wherein the electromagnetic wave transmitting and receiving means has aninductively coupled means for receiving electromagnetic waves from anexternal device.
 18. The temperature measuring device according to claim17, wherein the inductively coupled means receives an electromotiveforce from the external device through radio waves to supply electricpower to the temperature data detecting means.
 19. The temperaturemeasuring device according to claim 18, wherein temperature data isradio-transmitted from the temperature data detecting means via anantenna coil of the inductively coupled means to the external device.20. The temperature measuring device according to claim 19, wherein thetemperature data and an ID code are combined into a unit andradio-transmitted from the temperature data detecting means via theantenna coil to the external device.
 21. A temperature measuring methodcomprising: providing a flexible sheet with an opening; attaching theflexible sheet to a surface of a subject to thereby form an air layersealed by the opening; and measuring a temperature of the air layer bymeans of a temperature data detecting means, wherein a detecting part ofthe temperature data detecting means is so disposed as to be exposed tothe inside of the opening with nothing but an air layer between thesurface of the subject and an opposing surface of the detecting part.22. The temperature measuring method according to claim 21, whereintemperature data detected by the temperature data detecting means isstored in a memory provided on the flexible sheet, and the temperaturedata stored in the memory is read out after removal of the flexiblesheet from the subject.
 23. The temperature measuring method accordingto claim 21, wherein the subject is a human body.
 24. The temperaturemeasuring method according to claim 21, wherein the detecting partcomprises a chip thermistor which is directly exposed to the inside ofthe opening.
 25. The temperature measuring method according to claim 21,which is capable of measuring the temperature of the subject under thecondition where nothing but an air layer is present between the surfaceof the subject and an opposing surface of the detecting part.